منابع مشابه
economic optimization and energy consumption in tray dryers
دراین پروژه به بررسی مدل سازی خشک کردن مواد غذایی با استفاده از هوای خشک در خشک کن آزمایشگاهی نوع سینی دار پرداخته شده است. برای آنالیز انتقال رطوبت در طی خشک شدن به طریق جابجایی، یک مدل لایه نازک برای انتقال رطوبت، مبتنی بر معادله نفوذ فیک در نظر گفته شده است که شامل انتقال همزمان جرم و انرژی بین فاز جامد و گاز می باشد. پروفایل دما و رطوبت برای سه نوع ماده غذایی شامل سیب زمینی، سیب و موز در طی...
15 صفحه اولTechniques for reducing power consumption in CMP NUCA caches
Current trend of technology scaling makes it possible to put a huge number of transistors on a single die. While dynamic power consumption can benefit from technology scaling, static power consumption get worse, thus making the latter the dominant factor of power consumption in future microprocessor systems. As on-chip cache memories require the most part of chip area and number of transistors,...
متن کاملTechniques for reducing power consumption in CMP Nuca cache
Current trend of technology scaling makes it possible to put a huge number of transistors on a single die. While dynamic power consumption can benefit from technology scaling, static power consumption get worse, thus making the latter the dominant factor of power consumption in future microprocessors system. As on-chip cache memories require the most part of chip area and number of transistors,...
متن کاملPerformance-Aware CMP Fill Pattern Optimization
CMP fills are inserted to make metal density uniform and hence reduce post-polish height variations. Classical methods to insert fills focus on metal density uniformity, but do not take into consideration or are unable to minimize the impact of fills on circuit performance. In this paper, we develop a fill insertion method that heuristically minimizes coupling capacitance increase due to fill. ...
متن کاملCharacterization and Optimization of the Cmp Process
In the Chemical Mechanical Polishing (CMP) process used for microelectronics manufacturing, three contact regimes between the wafer surface and the polishing pad may be proposed: direct contact, mixed or partial contact, and hydroplaning. An effective in-situ method for characterizing the wafer/pad contact and a systematic way of relating contact conditions to the process parameters are both la...
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ژورنال
عنوان ژورنال: Journal of Advanced Mechanical Design, Systems, and Manufacturing
سال: 2009
ISSN: 1881-3054
DOI: 10.1299/jamdsm.3.47